|
项目 |
|
正常能力 |
先进能力 |
|
内层芯板厚度 |
Min |
0.1mm |
0.1mm |
|
Max |
2.0mm |
3.0mm |
|
|
线宽线距 |
Inner(1/3 or HOZ) |
3/3 mil +/- 20% |
2/2 mil +/- 20% |
|
Outer(1/3 or HOZ) |
3/3 mil +/- 20% |
2/2 mil +/- 20% |
|
|
阻抗控制 |
--- |
+/- 10% |
+/- 5%(except 50 Ohms) |
|
铜厚 |
Max |
3/3 Oz |
4/4 Oz |
|
完成板厚 |
Min |
0.4mm |
0.35mm |
|
Max |
3.2mm |
3.5mm |
|
|
完成板厚公差 |
>2.0mm and <3.5mm |
+/- 10% |
+/- 8% |
|
>1.0mm and <=2.0mm |
+/- 10% |
+/- 8% |
|
|
<=1.0mm |
+/- 0.10mm |
+/- 0.05mm |
|
|
层数 |
Max |
10 layers |
14 layers |
|
孔到铜间隙 |
4 layers |
7 mil |
6 mil |
|
6 layers |
8 mil |
6.5 mil |
|
|
8 layers |
8 mil |
7 mil |
|
|
最小机械孔完成孔径 |
Min drill bit |
8 mil |
6 mil |
|
纵横比 Aspect ratio |
Max |
12:1 |
14:1 |
|
V-cut余厚 |
--- |
+/- 4 mil |
+/- 3 mil |
|
绿油 |
Line to pad |
3 mil |
2 mil |
|
Solder mask bridge |
3 mil |
3 mil |
|
|
S/M bridge (black ink) |
5 mil |
4 mil |
|
|
Registration |
2 mil |
1.5 mil |
|
|
插件孔 |
Size |
+/- 3 mil |
+/- 2 mil |
|
压配孔 |
Size |
+/- 2 mil |
+/- 2 mil |
|
孔位公差 |
Positional |
+/- 3 mil |
+/- 2 mil |
|
非电镀 孔完成公差 |
Size |
+/- 2 mil |
+2/-0 or +0/-2 mil |
|
外形公差 |
--- |
+/- 5 mil |
+/- 2 mil |
|
HDI |
|
|
|
|
有镭射钻孔的板厚 |
Min |
0.6 mm |
0.35 mm |
|
Max |
2.0 mm |
2.4 mm |
|
|
盲孔类型 |
--- |
1+N+1,2+N+2,3+N+3,BVH |
Anylayer HDI |
|
树脂塞孔最小孔径 |
Min |
0.15 mm |
0.08 mm |
|
Max |
0.8 mm |
1.5 mm |
|
|
孔铜回填最小孔径 |
Min |
0.08 mm |
0.08 mm |
|
Max |
0.5 mm |
0.5 mm |
|
|
镭射钻孔大小 Laser drill size |
--- |
0.07 mm |
0.15 mm |
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