FR4-FLEX/M-VIAFlex ®
Fr4-flex/m-viaFlex ® There is no polyimide available for the application of rigid flex bonding plates, so there is no need for repeated bending. We have two types of rigid flex polyimide boards, and FR4 flex achieves low-cost and high reliability circuit boards using ordinary FR-4 as the raw material. On the other hand, ® M-via Flex combines RCC and FR-4 as the main raw materials to improve flexibility.
FR4's Flex/M via Flex ® Can be used as an alternative to connecting to loads by reducing process costs and lowering connectors.
Feature
Reduce process load and cost by reducing connectors
Provide multiple storage devices with three-dimensional structure and larger capacity
Design of Flexible Components and Improvement of Transmission Quality ZO
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